Ultra - wide field of view + extremely large depth of focus. It maintains a 13mm working distance at low magnification and allows for a certain degree of undulation on the sample surface (the 440μm depth of focus covers a wide range of height differences).

It can be applied to the full - panel scanning of PCB boards/wafers, the surface defect screening of large - sized parts, and automated production lines that need to integrate laser processing heads (the large spacing avoids collisions).