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Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

Part Number: PDCC14-601

Resin windows have strong cost adaptability, balancing detection accuracy and economy, making them suitable for batch and general-purpose scenarios; they have a stable noise suppression effect on medium-intensity light signals.



They are applicable to general-purpose optical detection equipment, such as regular ultraviolet light intensity monitoring in industrial production lines and basic light signal collection in small and medium-sized optical analysis equipment.

Caution
  • Product image is for representative purposes only and not reflective of every product available on this page.

Configured Specifications

Photosensitive Area Size (mm)3.7×3.7Dark Current (Max, pA)60
Junction Capacitance (Max, pF)120Rise Time (μs)0.26
Shunt Resistance (Min, GΩ)0.17Equivalent Noise Power (W/Hz¹/²)7.5×10⁻¹⁵
Unit Price
Total
Ship Date
TBD
Qty.
Quantity Price(USD)Ship Date
1-10TBD
10-TBD
NOTE : Ship Dates above are subject to change depending upon availability.

Explore Series

Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

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The photosensitive surface size is 2.6×2.6mm, compatible with detection from ultraviolet to near-infrared bands.
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Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

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Light-sensitive surface size 5.8×5.8mm.COB packaging is compatible with lead-free reflow soldering.
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Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

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Photosensitive surface size 10×10mm, COB package with lead-free reflow soldering.
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