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Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

Part Number: PDCC100-701

Designed with the largest photosensitive surface, it has the optimal capability to capture large-area and strong light signals. It can cover a large detection area without the need for multiple chip arrays, reducing integration complexity.


Although it has relatively large dark current and junction capacitance, it is suitable for low-frequency strong light detection scenarios. It does not require high-frequency response optimization and is suitable for scenarios where the detection area requirement is higher than the response speed requirement.

Caution
  • Product image is for representative purposes only and not reflective of every product available on this page.

Configured Specifications

Photosensitive Area Size (mm)10×10Dark Current (Max, pA)800
Junction Capacitance (Max, pF)1000Rise Time (μs)1.8
Shunt Resistance (Min, GΩ)0.07Equivalent Noise Power (W/Hz¹/²)1.2×10⁻¹⁴
Unit Price
Total
Ship Date
TBD
Qty.
Quantity Price(USD)Ship Date
1-10TBD
10-TBD
NOTE : Ship Dates above are subject to change depending upon availability.

Explore Series

Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

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The photosensitive surface size is 2.6×2.6mm, compatible with detection from ultraviolet to near-infrared bands.
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Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

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Photosensitive surface size 3.7×3.7mm, COB packaging supports lead-free reflow soldering.
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Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

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Light-sensitive surface size 5.8×5.8mm.COB packaging is compatible with lead-free reflow soldering.
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