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UV-enhanced Silicon PIN Photodiode (DIP Package)

Part Number: PDCD10-801

The medium photosensitive surface balances light absorption efficiency and circuit space. The clear peak wavelength facilitates the matching of optical systems, making it suitable for scenarios with high requirements on wavelength response consistency.


It is applicable to the optical signal receiving module of small and medium-sized optical analysis equipment (such as ultraviolet spectrophotometers), matching the application direction of the document "Optical Analysis Equipment".

Caution
  • Product image is for representative purposes only and not reflective of every product available on this page.

Configured Specifications

Photosensitive Area Size (mm)3.2×3.2Window MaterialResin
Spectral Response Range (nm)320~1060Dark Current (Max, pA)90
Junction Capacitance (Max, pF)120Equivalent Noise Power (W/Hz¹/²)9.2×10⁻¹⁵
Unit Price
Total
Ship Date
TBD
Qty.
Quantity Price(USD)Ship Date
1-10TBD
10-TBD
NOTE : Ship Dates above are subject to change depending upon availability.

Explore Series

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The window material is resin, and the photosensitive surface size is 2.6×2.6mm.
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UV-enhanced Silicon PIN Photodiode (DIP Package)

PDCD07-801
The default material for the window is resin, and the size of the photosensitive surface is 2.6×2.6mm.
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UV-enhanced Silicon PIN Photodiode (DIP Package)

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The window material is quartz, and the photosensitive surface size is 2.6×2.6mm.
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UV-enhanced Silicon PIN Photodiode (DIP Package)

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The window material is resin, and the photosensitive surface size is 5.8×5.8mm.
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