Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)

Introduction:

This device has a spectral response range of 320~1060nm, featuring low dark current, low junction capacitance, and optimized response to ultraviolet wavelengths. It adopts COB packaging, which is compatible with lead-free reflow soldering, and is suitable for optical power detection and optical analysis equipment.

It is used for real-time monitoring of ultraviolet light power density in UV LED curing equipment. The COB package is compatible with lead-free reflow soldering and can be compactly embedded next to the lamp set. It accurately captures the light intensity in the optimized ultraviolet band of 320~400nm. It ensures low-light precision with low dark current and response speed with low junction capacitance. It feeds back data in real-time to adjust the lamp set to avoid curing problems or damage to the substrate.

Features:

• COB, low thermal resistance for heat transfer control and ultraviolet attenuation
• Lead-free soldering with low ultraviolet attenuation, no calibration required
• Deep ultraviolet dark current suppression ratio ≥ 50:1
• Multi-chip array with small deviation in ultraviolet response

Dimension:

Common Parameter Specification Table

Spectral response

Dark current vs. reverse voltage

Junction capacitance vs. reverse voltage

Photosensitivity temperature characteristics