Low Dark Current Silicon PIN Photodiode (TO18 packaging)
Core components in the field of medium and high-precision optical signal detection
- Excellent optical performance
- Strong structural adaptability
- Good environmental stability
PDCT01-201
TO18 package, silicon PIN material, spectral response range 350~1060nm, optimized visible light response.
PDCT01-202
Photosensitive area size: 1.1×1.1mm, optical window type is optical glass ball window, number of pins: 2pin;
PDCT01-205
Photosensitive area size: 1.1×1.1mm, light window type is optical glass flat window, number of pins: 3pin.
PDCT02-201
Photosensitive area size Φ1.5mm (larger than the 1.1×1.1mm of the 01 series), light window type is optical glass flat window, number of pins is 2pin;
PDCT02-202
Photosensitive area size Φ1.5mm, light window type is optical glass spherical window.
Low Dark Current Silicon PIN Photodiode (COB packaging)
Core devices in the fields of low-light detection and precision measurement
- Wide-spectrum precise response
- Ultra-low noise detection capability
- High integration and mass production adaptability
- Industrial-grade environmental reliability
PDCC01-001
The photosensitive surface size is the smallest (1.1×1.1mm, square), with COB packaging and resin as the window material.
PDCC07-003
The photosensitive surface has a medium size (2.6×2.6mm, square), with COB packaging and a resin window.
PDCC07-101
Circular photosensitive surface (Φ3.0mm), COB package, resin window.
PDCC14-001
The photosensitive surface size is medium to large (3.7×3.7mm, square), with COB packaging and a resin window.
PDCC34-001
Large photosensitive surface size (5.8×5.8mm, square), COB package, resin window.
PDCC100-001
The photosensitive surface has the largest size (10×10mm, square), with COB packaging and a resin window.
Low Dark Current Silicon PIN Photodiode (DIP package)
High-precision photodetection device based on silicon-based PIN structure
- Strong encapsulation adaptability
- Extremely low dark current
- Excellent environmental tolerance
Low Dark Current Silicon PIN Photodiode (TO packaging)
Silicon PIN structure photoelectric conversion device
- Flexible packaging adaptation
- Extremely low dark current
- Industrial-grade tolerance
- Fast response speed
PDCT01-201
1.1×1.1mm square photosensitive surface.
PDCT01-202
1.1×1.1mm photosensitive surface.
PDCT07-001
2.6×2.6mm square photosensitive surface.
PDCT14-001
3.7×3.7mm square photosensitive surface.
PDCT15-001
3.9×3.9mm square photosensitive surface.
PDCT34-101
5.8×5.8mm square photosensitive surface (the largest in the series).
Near-infrared enhanced silicon PIN photodiode (COB package)
Silicon-based PIN structure photoelectric conversion devices optimized for response efficiency in the near-infrared band
- Enhanced near-infrared response
• Low dark current and high precision
• Resistance to basic environments
• Friendly to mass production costs
Near-infrared enhanced silicon PIN photodiode (DIP package)
A passive photoelectric conversion functional device with a dual in-line package (DIP) through-hole package.
- Accurately capture weak signals
- Low dark current + high linearity
- Strong environmental adaptability + low-cost maintenance
Near-infrared enhanced silicon PIN photodiode (TO package)
Silicon-based PIN junction near-infrared optimized photoelectric conversion device.
- Highly efficient response in the near-infrared band
- High detection accuracy
- Fast response speed
- Wide scene adaptability
Silicon PIN photodiode in the ultraviolet to near-infrared band
A broad-spectrum photoelectric conversion device whose spectral response covers the ultraviolet to near-infrared bands.
- Accurate broadband response
- Low dark current with PIN structure
- High photoelectric linearity
- Stable environmental adaptability
PDCT01-F01
Spectral response: 190~1100nm, captures light across UV to near-infrared.
PDCT06-F01
Pectral response 190~1100nm, peak wavelength 1000nm, excellent near-infrared responsivity.
PDCT25-F01
190~1100nm wide spectral response, high conversion efficiency at near-IR.
PDCD06-F01
No UV-NIR response gap, strong full-wavelength adaptability.
PDCD25-F01
It has a large light absorption area and strong ability to capture weak light.
PDCD100-F01
The size of the photosensitive surface is 10.0×10.0mm, and the light absorption is the maximum.
Ultraviolet-enhanced Silicon PIN Photodiode (COB Package)
Optoelectronic conversion device with enhanced ultraviolet band response and COB package integration.
- High sensitivity in the ultraviolet band
- Strong integration adaptability
- Excellent environmental stability
PDCC07-601
The photosensitive surface size is 2.6×2.6mm, compatible with detection from ultraviolet to near-infrared bands.
PDCC14-601
Photosensitive surface size 3.7×3.7mm, COB packaging supports lead-free reflow soldering.
PDCC34-601
Light-sensitive surface size 5.8×5.8mm.COB packaging is compatible with lead-free reflow soldering.
PDCC100-701
Photosensitive surface size 10×10mm, COB package with lead-free reflow soldering.
UV-enhanced Silicon PIN Photodiode (DIP Package)
Optoelectronic conversion devices with DIP dual in-line package
- High-sensitivity detection in the ultraviolet band
- Engineering adaptability of DIP packaging
- Wide temperature range stability and low noise
- Plug-and-play compatibility for multiple scenarios
PDCD07-601
The window material is resin, and the photosensitive surface size is 2.6×2.6mm.
PDCD07-801
The default material for the window is resin, and the size of the photosensitive surface is 2.6×2.6mm.
PDCD07-802
The window material is quartz, and the photosensitive surface size is 2.6×2.6mm.
PDCD10-801
The window material is resin, and the photosensitive surface size is 3.2×3.2mm.
PDCD34-701
The window material is resin, and the photosensitive surface size is 5.8×5.8mm.
PDCD34-703
The window material is quartz, and the photosensitive surface size is 5.8×5.8mm.
PDCD100-301
The window material is resin, and the photosensitive surface size is 10×10mm.
PDCD100-302
The window material is quartz, and the size of the photosensitive surface is 10×10mm.
UV-enhanced Silicon PIN Photodiode (TO Package)
Optoelectronic conversion device with TO transistor package and metal hermetic sealing
- Metal hermetic packaging, stable over a wide temperature range
- High-sensitivity optimization in the ultraviolet band
- Low noise and fast response
- Industrial-grade environmental tolerance
- Flexible adaptation of glass/quartz windows
PDCT07-601
Optical glass (flat window), photosensitive surface size 2.6×2.6mm.
PDCT07-602
The window material is upgraded to quartz (flat window), and the photosensitive surface size is 2.6×2.6mm.
PDCT14-601
The window is made of optical glass (flat window), and the size of the photosensitive surface is 3.7×3.7mm.
PDCT14-602
The window material is quartz (flat window), and the photosensitive surface size is 3.7×3.7mm.
PDCT16-601
The window material is optical glass (flat window), and the photosensitive surface size is 4×4mm.
PDCT16-602
The window material is quartz (flat window), and the photosensitive surface size is 4×4mm.
PDCT34-701
The window material is optical glass (flat window), and the photosensitive surface size is 5.8×5.8mm.
PDCT34-702
The window material is quartz (flat window), and the photosensitive surface size is 5.8×5.8mm.
