| 数量 | 价格(USD) | 发货日期 |
|---|---|---|
| 1-10 | 待定 | |
| 10- | 待定 |
注意：发货日期以上是因库存不足而调整的。
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UV-enhanced Silicon PIN Photodiode (DIP Package)
产品编号: PDCD100-301
Designed with the largest photosensitive surface, it can cover an ultra-large detection area without the need for multi-chip splicing. It is suitable for detecting strong light and large-area optical signals, and reduces the complexity of the optical system inside the device.
It is suitable for optical power density monitoring of large-scale ultraviolet curing equipment (such as curing of wide-format plastic parts) and industrial-grade large-area strong light detection terminals, matching high-power scenarios of "optical power detection".
注意事项
- 产品图片仅供参考，并不代表所有产品。
已配置规格
| Photosensitive Area Size (mm) | 10×10 | Window Material | Resin |
| Spectral Response Range (nm) | 320~1060 | Dark Current (Max, pA) | 800 |
| Junction Capacitance (Max, pF) | 1000 | Equivalent Noise Power (W/Hz¹/²) | 1.2×10⁻¹⁴ |
浏览全部型号
UV-enhanced Silicon PIN Photodiode (DIP Package)
PDCD07-601
The window material is resin, and the photosensitive surface size is 2.6×2.6mm.
UV-enhanced Silicon PIN Photodiode (DIP Package)
PDCD07-801
The default material for the window is resin, and the size of the photosensitive surface is 2.6×2.6mm.
UV-enhanced Silicon PIN Photodiode (DIP Package)
PDCD07-802
The window material is quartz, and the photosensitive surface size is 2.6×2.6mm.
UV-enhanced Silicon PIN Photodiode (DIP Package)
PDCD10-801
The window material is resin, and the photosensitive surface size is 3.2×3.2mm.
