Balanced medium magnification and NA, resolution adapted to submicron structures, moderate working distance, and depth of field matching moderately rough surfaces.

Applications include:
Measurement of geometric features of chip pads (such as solder ball height and spacing);
Observation of wrinkles and grain boundaries in graphene/molybdenum disulfide (MoS₂) (contrast enhanced by DI technology);
Detection of micro-defects in small mechanical parts (such as flash and cracks in injection-molded parts).