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UV-enhanced Silicon PIN Photodiode (DIP Package)

Part Number: PDCD100-301

Designed with the largest photosensitive surface, it can cover an ultra-large detection area without the need for multi-chip splicing. It is suitable for detecting strong light and large-area optical signals, and reduces the complexity of the optical system inside the device.


It is suitable for optical power density monitoring of large-scale ultraviolet curing equipment (such as curing of wide-format plastic parts) and industrial-grade large-area strong light detection terminals, matching high-power scenarios of "optical power detection".

Caution
  • Product image is for representative purposes only and not reflective of every product available on this page.

Configured Specifications

Photosensitive Area Size (mm)10×10Window MaterialResin
Spectral Response Range (nm)320~1060Dark Current (Max, pA)800
Junction Capacitance (Max, pF)1000Equivalent Noise Power (W/Hz¹/²)1.2×10⁻¹⁴
Unit Price
Total
Ship Date
TBD
Qty.
Quantity Price(USD)Ship Date
1-10TBD
10-TBD
NOTE : Ship Dates above are subject to change depending upon availability.

Explore Series

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The window material is quartz, and the photosensitive surface size is 2.6×2.6mm.
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The window material is resin, and the photosensitive surface size is 3.2×3.2mm.
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The window material is resin, and the photosensitive surface size is 5.8×5.8mm.
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