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UV-Enhanced Silicon PIN Photodiode (DIP Package)

Part Number: PDCD34-701

A large photosensitive surface improves the capture efficiency of medium-intensity light signals, enabling coverage of a relatively large detection area without the need for a multi-chip array.



It reduces the complexity of circuit integration and is suitable for medium-power light detection scenarios.

Caution
  • Product image is for representative purposes only and not reflective of every product available on this page.

Configured Specifications

Photosensitive Area Size (mm)5.8×5.8Window MaterialResin
Spectral Response Range (nm)320~1060Dark Current (Max, pA)300
Junction Capacitance (Max, pF)400Equivalent Noise Power (W/Hz¹/²)9.9×10⁻¹⁵
Unit Price
Total
Ship Date
TBD
Qty.
Quantity Price(USD)Ship Date
1-10TBD
10-TBD
NOTE : Ship Dates above are subject to change depending upon availability.

Explore Series

UV-Enhanced Silicon PIN Photodiode (DIP Package)

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The window material is resin, and the photosensitive surface size is 2.6×2.6mm.
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UV-Enhanced Silicon PIN Photodiode (DIP Package)

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The default material for the window is resin, and the size of the photosensitive surface is 2.6×2.6mm.
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UV-enhanced Silicon PIN Photodiode (DIP Package)

PDCD07-802
The window material is quartz, and the photosensitive surface size is 2.6×2.6mm.
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UV-Enhanced Silicon PIN Photodiode (DIP Package)

PDCD10-801
The window material is resin, and the photosensitive surface size is 3.2×3.2mm.
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