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UV-enhanced Silicon PIN Photodiode (DIP Package)

Optoelectronic conversion devices with DIP dual in-line package

  • High-sensitivity detection in the ultraviolet band
  • Engineering adaptability of DIP packaging
  • Wide temperature range stability and low noise
  • Plug-and-play compatibility for multiple scenarios
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Data Sheet

Overview

Introduction:

This ultraviolet-enhanced silicon PIN photodiode has a spectral response range of 250~1060nm, featuring low dark current, low junction capacitance, and optimized ultraviolet response. It adopts a DIP package and is suitable for optical power detection and optical analysis equipment.

It efficiently captures ultraviolet light signals, while being compatible with the inherent near-infrared band (700~1100nm) response capability of silicon PIN diodes, and is suitable for through-hole circuit installation scenarios.


Features:

  • Composite coating with UV aging resistance
  • Deep ultraviolet passivation to suppress leakage current
  • DIP housing with vibration resistance and reliability
  • Minimal cross-section response fluctuation


Dimension:




Specifications

Applications

Serivce & Support

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