The TO8 packaging structure is more robust (suitable for harsh industrial environments) and can cover an ultra-large detection area without the need for multi-chip splicing, reducing integration complexity.
It is suitable for optical power density monitoring in large-scale ultraviolet curing equipment (such as wide plastic parts and PCB board curing), and industrial-grade large-area strong light detection terminals.
| Photosensitive Area Size (mm) | Window Material | Spectral Response Range (nm) | Dark Current (Max, pA) | Junction Capacitance (Max, pF) | Equivalent Noise Power (W/Hz¹/²) |
|---|---|---|---|---|---|
| 5.8×5.8 | Optical Glass/Flat Window | 320~1060 | 90 | 400 | 1.1×10⁻¹⁴ |
| Quantity | Price(USD) | Ship Date |
|---|---|---|
| 1-10 | TBD | |
| 10- | TBD |
