The TO8 packaging structure is more robust (suitable for harsh industrial environments) and can cover an ultra-large detection area without the need for multi-chip splicing, reducing integration complexity.
It is suitable for optical power density monitoring in large-scale ultraviolet curing equipment (such as wide plastic parts and PCB board curing), and industrial-grade large-area strong light detection terminals.
| Photosensitive Area Size (mm) | 5.8×5.8 | Window Material | Optical Glass/Flat Window |
| Spectral Response Range (nm) | 320~1060 | Dark Current (Max, pA) | 90 |
| Junction Capacitance (Max, pF) | 400 | Equivalent Noise Power (W/Hz¹/²) | 1.1×10⁻¹⁴ |
| Quantity | Price(USD) | Ship Date |
|---|---|---|
| 1-10 | TBD | |
| 10- | TBD |
