CF Plan TI/DI Series Objectives

The magnification and numerical aperture are balanced, with resolution suitable for submicron-level structures, moderate depth of focus, and compatibility with surfaces of medium roughness.

Applications:
It can be used for measuring the geometric features (height, spacing) of semiconductor chip pads, or for observing wrinkles and grain boundaries in two-dimensional materials such as graphene and MoS₂ (DI technology enhances structural contrast).