https://source.venuslabtech.com/mall-prod/345e8154-bbd3-4146-aa50-79c14951a795.png

Near-Infrared Enhanced Silicon PIN Photodiode (DIP Package)

Part Number: PDCD34-501

High-speed response: With a rise time of 50μs and a low junction capacitance of 300pF, it captures high-frequency near-infrared signals faster, reduces signal delay, and is suitable for high-speed optical signal detection scenarios.



Low noise: A maximum dark current of 0.9pA and a low equivalent noise power can further reduce detection noise, ensuring the accuracy of weak near-infrared light signal conversion.

Caution
  • Product image is for representative purposes only and not reflective of every product available on this page.

Configured Specifications

Photosensitive Area Size5.8×5.8mmRise Time (tr)50μs
Junction Capacitance (Cj, VR=10mV)300pFMaximum Dark Current (ID, VR=0V)0.9pA
Peak Responsivity Wavelength & Photoresponse920nm (0.62A/W)Noise Equivalent Power (NEP)1.5×10⁻¹⁴ W/Hz¹/²
Unit Price
Total
Ship Date
TBD
Qty.
Quantity Price(USD)Ship Date
1-10TBD
10-TBD
NOTE : Ship Dates above are subject to change depending upon availability.

Explore Series

Near-infrared enhanced silicon PIN photodiode (DIP package)

PDCD100-501
The photosensitive area size is 10×10mm, and it has high near-infrared detection efficiency.
Ships as soon as Same Day
Stock Items Included
Telegram LogoWhatsApp Logo