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Near-infrared enhanced silicon PIN photodiode (COB package)

Silicon-based PIN structure photoelectric conversion devices optimized for response efficiency in the near-infrared band

  • Enhanced near-infrared response
    • Low dark current and high precision
    • Resistance to basic environments
    • Friendly to mass production costs
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Data Sheet

Overview

Introduction:

This device has a spectral response range covering 350~1100nm, featuring both optimized near-infrared wavelength response and low dark current characteristics. It is suitable for photoelectric measurement instruments, optical analysis equipment, and optical power monitoring scenarios.


It accurately converts near-infrared light signals into electrical signals, especially overcoming the shortcoming of ordinary silicon PIN photodiodes in their response to the near-infrared band, making them suitable for scenarios such as near-infrared detection, communication, and sensing.


Features:

  • Wire bonding with low resistance and low loss
    • Near-infrared custom anti-reflection coating to prevent stray light
    • Multi-chip array with precise spacing control
    • Package protective layer selected according to needs
    • Low junction capacitance, suitable for high-frequency signals
    • Low temperature drift to ensure data consistency


Dimension:

Specifications

Applications

Serivce & Support

Explore Series

Model
Photosensitivity (Typ., A/W)
Junction Capacitance (f=100kHz,V_R=0V, Typ./Max., pF)
Photosensitive Area Size (mm)
Window Material
Rise Time (R_L=1kΩ,V_R=0V, Typ., μs)
Dark Current (V_R=10mV, Typ./Max., pA)
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